Applications > Silicon Inspection

Silicon Inspection

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Silicon Wafer and Silicon Die Edge Inspection

Wafer Inspection – the science of finding defects on a silicon wafer – is challenging and costly. Wafer Inspection has become an integral process in the semiconductor industry. Whether detecting cracks and defects on silicon wafers or solar cell panels, or for achieving a failure analysis of integrated circuits, detecting defects helps to improve yields and overall productivity.

Until now, short wavelength infrared (SWIR) imaging systems have been served with legacy InGaAs SWIR camera technology. SWIR Cameras are used to perform quality inspection of semiconductor wafers and die. Semiconductor wafers and chips made of silicon are transparent to SWIR light. Frontside or backside illumination of the silicon-based devices with infrared lighting enables imaging of wafer alignment marks, micro-cracks, and other fine features.

Semiconductor edge crack inspection systems perform advance failure analysis when using the SWIR cameras that can image the smallest defects, run at the fastest frame rates, and image the widest field-of-view. Thus giving you the fastest and most accurate results possible.

Wafer Inspection Cameras

The Acuros CQD SWIR cameras deliver 1280 x 1024 and 1920 x 1080 imaging to meet the silicon inspection challenge. Review our product offerings, and application notes and contact SWIR Vision today to discover the best camera to meet your special requirements.

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Backside illumination of bonded wafer pair alignment marks
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Acuros SWIR camera inspection of edge cracks on semiconductor die edge